Data Center Direct-to-Chip (D2C) Cooling

As modern data centers push the boundaries of computational density — driven by AI, machine learning, and high-performance computing workloads — traditional air cooling is no longer sufficient to manage the thermal demands of today's processors.

Direct-to-chip (D2C) cooling addresses this challenge by delivering liquid coolant through a cold plate mounted directly onto the processor or GPU, pulling heat away from the source before it can dissipate into the surrounding environment.

This targeted approach enables precise thermal management at the component level, supporting chips that generate anywhere from 300W to over 1,000W of heat per socket — far beyond what air-based systems can reliably handle. The coolant, typically water or a dielectric fluid, absorbs heat at the chip surface and carries it to a facility-level heat exchanger or cooling distribution unit (CDU), where it is rejected or recaptured.

D2C cooling systems typically operate with supply water temperatures between 18°C and 45°C, and can achieve cooling capacities exceeding several hundred kilowatts per rack — making them ideal for ultra-high-density deployments. By dramatically reducing reliance on computer room air handlers (CRAHs) and chillers, direct-to-chip solutions also improve overall data center PUE (Power Usage Effectiveness) and support sustainability goals.

Contact General ThermoDynamics & Airtech to learn how our cold plates and heat exchangers can be integrated into your infrastructure to keep your most demanding workloads running at peak performance.